Polymer
Low-temperature deposition, low thermal expansion polyimide
☆Achieves low thermal expansion through low-temperature deposition
WGv-2400 Series (GBL Type): Enables deposition at lower temperatures
WGv-2500 Series (NMP Type): Features a lower coefficient of thermal expansion
Features
◆ Enables film formation at lower temperatures than conventional polyimides, reducing thermal stress and allowing use similar to epoxy resins. Additionally, it offers high production efficiency and labor savings.
※WGv-2400 Series (GBL Type) ... Film formation temperature: 180–200°C
※WGv-2500 Series (NMP Type) ... Film formation temperature: 250°C
◆ Graded thermal expansion coefficients of 2–20 ppm/K (matchable to various substrate thermal expansion coefficients)
◆ Varnish can be stored at room temperature.
Purpose
◆ Interlayer Insulation Film (for semiconductor devices, multilayer printed wiring boards, package substrates)
◆ Semiconductor Device Protective Film
◆ Buffer Coat Film
◆ Insulation Film for Silicon/Glass Interposers
Characteristics
Table WGv-2401,2501, Thermal Properties and Film Properties of Commercial PI-Based Varnishes
【Low-Temperature Film Deposition】 Competitor Product Our Product
Approx. 18mm CTE (Cu substrate compatible): Deposition temperature Competitor 350°C → Our Product 180°C
Approx. 3mm CTE (Si substrate compatible): Deposition temperature Competitor 450°C → Our Product 250°C