Polymer
Low-Dielectric Polyimide
Overview
The low-dielectric polyimide developed by our company is a high-performance material designed to meet the requirements of next-generation high-speed communication and high-frequency devices. Compared to conventional polyimides, it offers a lower dielectric constant and low dielectric loss tangent, while also maintaining high heat resistance and low water absorption. These properties contribute to enhanced performance in cutting-edge technological fields, including 5G and 6G communications.
Features
Low dielectric constant and low dielectric loss tangent: Significantly reduces high-frequency signal loss and enhances communication performance
High heat resistance: Maintains excellent dimensional stability and reliability even in high-temperature environments
Low water absorption: Minimizes property degradation caused by humidity fluctuations
High adhesion: Provides excellent adhesion to various substrates, enabling compatibility with diverse processing methods